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Aethermor
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Fix production benchmark: physical thermal model + envelope gate
Critical fix: production suite was applying convection to die area instead of package/IHS area, producing nonphysical junction temperatures (3,000- 12,000 °C) that the release gate accepted as PASS. Changes: - cases.csv: add pkg_area_mm2 and h_conv per chip; model EPYC/chiplet designs as single CCD (matching real_world_validation.py approach) - run_production_suite.py: use R_conv = 1/(h × A_package) instead of R_conv = 1/(h × A_die); parametrize die thickness by node (200µm for ≤7nm, 775µm for older); add operating-envelope gate (250-700 K) - Gold outputs re-frozen with corrected model - Release benchmark report rebuilt with physical temperatures - benchmark_protocol.md: add envelope gate to threshold table - EXTERNAL_VALIDATION.md: document JEDEC θ_jc and IR thermal correlations as completed external correlations; add internal pilot (#1) documenting the nonphysical-temperature bug discovery and fix All 20 cases now produce Tj within 38-184 °C (envelope: 250-700 K). All 5 release gates pass. Gold outputs verified.
1 parent 68e13b3 commit 1275fc1

6 files changed

Lines changed: 338 additions & 160 deletions

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‎benchmarks/gold_outputs/production_suite_v1.0.0.json‎

Lines changed: 149 additions & 88 deletions
Original file line numberDiff line numberDiff line change
@@ -1,189 +1,249 @@
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{
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"version": "1.0.0",
3-
"timestamp": "2026-03-26T13:44:00",
3+
"timestamp": "2026-03-26T22:10:51",
44
"case_results": [
55
{
66
"chip": "NVIDIA A100",
77
"segment": "accelerator",
8-
"Tj_C": 77.81,
9-
"R_cond_KW": 0.00634,
10-
"theta_jc_model": 0.00634,
11-
"power_density_Wm2": 484261.5,
8+
"Tj_C": 43.5,
9+
"Tj_K": 316.7,
10+
"R_cond_KW": 0.001636,
11+
"R_conv_KW": 0.04,
12+
"theta_jc_model": 0.001636,
13+
"power_density_Wm2": 484262.0,
1214
"valid": true,
13-
"theta_jc_ratio": 0.2186
15+
"in_envelope": true,
16+
"theta_jc_ratio": 0.0564
1417
},
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{
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"chip": "NVIDIA H100",
1720
"segment": "accelerator",
18-
"Tj_C": 117.35,
19-
"R_cond_KW": 0.006433,
20-
"theta_jc_model": 0.006433,
21-
"power_density_Wm2": 859950.9,
22-
"valid": true
21+
"Tj_C": 56.0,
22+
"Tj_K": 329.2,
23+
"R_cond_KW": 0.00166,
24+
"R_conv_KW": 0.04,
25+
"theta_jc_model": 0.00166,
26+
"power_density_Wm2": 859951.0,
27+
"valid": true,
28+
"in_envelope": true
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},
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{
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"chip": "AMD MI300X",
2632
"segment": "accelerator",
27-
"Tj_C": 132.09,
28-
"R_cond_KW": 0.006982,
29-
"theta_jc_model": 0.006982,
33+
"Tj_C": 54.1,
34+
"Tj_K": 327.2,
35+
"R_cond_KW": 0.001802,
36+
"R_conv_KW": 0.0345,
37+
"theta_jc_model": 0.001802,
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"power_density_Wm2": 1000000.0,
31-
"valid": true
39+
"valid": true,
40+
"in_envelope": true
3241
},
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{
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"chip": "AMD EPYC 9654",
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"segment": "server",
36-
"Tj_C": 10053.03,
37-
"R_cond_KW": 0.072729,
38-
"theta_jc_model": 0.072729,
39-
"power_density_Wm2": 5000000.0,
40-
"valid": true
45+
"Tj_C": 41.2,
46+
"Tj_K": 314.4,
47+
"R_cond_KW": 0.018769,
48+
"R_conv_KW": 0.4598,
49+
"theta_jc_model": 0.018769,
50+
"power_density_Wm2": 416667.0,
51+
"valid": true,
52+
"in_envelope": true
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},
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{
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"chip": "Intel Xeon w9-3495X",
4456
"segment": "server",
45-
"Tj_C": 1781.43,
46-
"R_cond_KW": 0.013091,
47-
"theta_jc_model": 0.013091,
57+
"Tj_C": 183.6,
58+
"Tj_K": 456.7,
59+
"R_cond_KW": 0.003378,
60+
"R_conv_KW": 0.4444,
61+
"theta_jc_model": 0.003378,
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"power_density_Wm2": 875000.0,
49-
"valid": true
63+
"valid": true,
64+
"in_envelope": true
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},
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{
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"chip": "Intel i9-13900K",
5368
"segment": "desktop",
54-
"Tj_C": 4954.18,
69+
"Tj_C": 114.2,
70+
"Tj_K": 387.4,
5571
"R_cond_KW": 0.020375,
72+
"R_conv_KW": 0.3249,
5673
"theta_jc_model": 0.020375,
57-
"power_density_Wm2": 984435.8,
74+
"power_density_Wm2": 984436.0,
5875
"valid": true,
76+
"in_envelope": true,
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"theta_jc_ratio": 0.0474
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},
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{
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"chip": "AMD Ryzen 9 7950X",
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"segment": "desktop",
64-
"Tj_C": 12011.22,
65-
"R_cond_KW": 0.073753,
66-
"theta_jc_model": 0.073753,
67-
"power_density_Wm2": 2394366.2,
82+
"Tj_C": 86.8,
83+
"Tj_K": 359.9,
84+
"R_cond_KW": 0.019033,
85+
"R_conv_KW": 0.3333,
86+
"theta_jc_model": 0.019033,
87+
"power_density_Wm2": 2394366.0,
6888
"valid": true,
69-
"theta_jc_ratio": 0.6705
89+
"in_envelope": true,
90+
"theta_jc_ratio": 0.173
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},
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{
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"chip": "Apple M1",
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"segment": "mobile",
74-
"Tj_C": 3361.06,
75-
"R_cond_KW": 0.043637,
76-
"theta_jc_model": 0.043637,
77-
"power_density_Wm2": 166666.7,
78-
"valid": true
95+
"Tj_C": 52.1,
96+
"Tj_K": 325.2,
97+
"R_cond_KW": 0.011261,
98+
"R_conv_KW": 1.25,
99+
"theta_jc_model": 0.011261,
100+
"power_density_Wm2": 166667.0,
101+
"valid": true,
102+
"in_envelope": true
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},
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{
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"chip": "Apple M2 Pro",
82106
"segment": "mobile",
83-
"Tj_C": 2659.12,
84-
"R_cond_KW": 0.022967,
85-
"theta_jc_model": 0.022967,
86-
"power_density_Wm2": 131578.9,
87-
"valid": true
107+
"Tj_C": 57.0,
108+
"Tj_K": 330.2,
109+
"R_cond_KW": 0.005927,
110+
"R_conv_KW": 1.0,
111+
"theta_jc_model": 0.005927,
112+
"power_density_Wm2": 131579.0,
113+
"valid": true,
114+
"in_envelope": true
88115
},
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{
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"chip": "Qualcomm Snapdragon 8 Gen 2",
91118
"segment": "mobile",
92-
"Tj_C": 1978.58,
93-
"R_cond_KW": 0.042573,
94-
"theta_jc_model": 0.042573,
119+
"Tj_C": 127.0,
120+
"Tj_K": 400.1,
121+
"R_cond_KW": 0.010987,
122+
"R_conv_KW": 8.3333,
123+
"theta_jc_model": 0.010987,
95124
"power_density_Wm2": 97561.0,
96-
"valid": true
125+
"valid": true,
126+
"in_envelope": true
97127
},
98128
{
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"chip": "AMD Ryzen 7 5800X",
100130
"segment": "desktop",
101-
"Tj_C": 6515.12,
102-
"R_cond_KW": 0.064648,
103-
"theta_jc_model": 0.064648,
104-
"power_density_Wm2": 1296296.3,
105-
"valid": true
131+
"Tj_C": 63.6,
132+
"Tj_K": 336.8,
133+
"R_cond_KW": 0.016683,
134+
"R_conv_KW": 0.3333,
135+
"theta_jc_model": 0.016683,
136+
"power_density_Wm2": 1296296.0,
137+
"valid": true,
138+
"in_envelope": true
106139
},
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{
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"chip": "Intel Xeon Platinum 8380",
109142
"segment": "server",
110-
"Tj_C": 847.17,
143+
"Tj_C": 149.0,
144+
"Tj_K": 422.1,
111145
"R_cond_KW": 0.007934,
146+
"R_conv_KW": 0.4444,
112147
"theta_jc_model": 0.007934,
113-
"power_density_Wm2": 409090.9,
114-
"valid": true
148+
"power_density_Wm2": 409091.0,
149+
"valid": true,
150+
"in_envelope": true
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},
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{
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"chip": "Apple M1 Ultra",
118154
"segment": "mobile",
119-
"Tj_C": 1456.17,
120-
"R_cond_KW": 0.012468,
121-
"theta_jc_model": 0.012468,
122-
"power_density_Wm2": 142857.1,
123-
"valid": true
155+
"Tj_C": 60.4,
156+
"Tj_K": 333.5,
157+
"R_cond_KW": 0.003218,
158+
"R_conv_KW": 0.5556,
159+
"theta_jc_model": 0.003218,
160+
"power_density_Wm2": 142857.0,
161+
"valid": true,
162+
"in_envelope": true
124163
},
125164
{
126165
"chip": "NVIDIA RTX 4090",
127166
"segment": "accelerator",
128-
"Tj_C": 3725.3,
129-
"R_cond_KW": 0.008598,
130-
"theta_jc_model": 0.008598,
131-
"power_density_Wm2": 738916.3,
132-
"valid": true
167+
"Tj_C": 90.3,
168+
"Tj_K": 363.5,
169+
"R_cond_KW": 0.002219,
170+
"R_conv_KW": 0.1389,
171+
"theta_jc_model": 0.002219,
172+
"power_density_Wm2": 738916.0,
173+
"valid": true,
174+
"in_envelope": true
133175
},
134176
{
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"chip": "AMD EPYC 7763",
136178
"segment": "server",
137-
"Tj_C": 6958.53,
138-
"R_cond_KW": 0.064648,
139-
"theta_jc_model": 0.064648,
140-
"power_density_Wm2": 3456790.1,
141-
"valid": true
179+
"Tj_C": 43.5,
180+
"Tj_K": 316.7,
181+
"R_cond_KW": 0.016683,
182+
"R_conv_KW": 0.4598,
183+
"theta_jc_model": 0.016683,
184+
"power_density_Wm2": 432099.0,
185+
"valid": true,
186+
"in_envelope": true
142187
},
143188
{
144189
"chip": "Heterogeneous SoC (synthetic)",
145190
"segment": "soc",
146-
"Tj_C": 1029.47,
147-
"R_cond_KW": 0.052365,
148-
"theta_jc_model": 0.052365,
191+
"Tj_C": 77.5,
192+
"Tj_K": 350.7,
193+
"R_cond_KW": 0.013514,
194+
"R_conv_KW": 1.0,
195+
"theta_jc_model": 0.013514,
149196
"power_density_Wm2": 500000.0,
150-
"valid": true
197+
"valid": true,
198+
"in_envelope": true
151199
},
152200
{
153201
"chip": "Adiabatic crossover (synthetic)",
154202
"segment": "paradigm",
155-
"Tj_C": 528.16,
156-
"R_cond_KW": 0.052365,
157-
"theta_jc_model": 0.052365,
203+
"Tj_C": 52.2,
204+
"Tj_K": 325.3,
205+
"R_cond_KW": 0.013514,
206+
"R_conv_KW": 1.0,
207+
"theta_jc_model": 0.013514,
158208
"power_density_Wm2": 250000.0,
159-
"valid": true
209+
"valid": true,
210+
"in_envelope": true
160211
},
161212
{
162213
"chip": "Cooling tradeoff (synthetic)",
163214
"segment": "cooling",
164-
"Tj_C": 1032.09,
165-
"R_cond_KW": 0.052365,
166-
"theta_jc_model": 0.052365,
215+
"Tj_C": 38.2,
216+
"Tj_K": 311.4,
217+
"R_cond_KW": 0.013514,
218+
"R_conv_KW": 0.1,
219+
"theta_jc_model": 0.013514,
167220
"power_density_Wm2": 1000000.0,
168-
"valid": true
221+
"valid": true,
222+
"in_envelope": true
169223
},
170224
{
171225
"chip": "Diamond spreader (synthetic)",
172226
"segment": "material",
173-
"Tj_C": 237.32,
174-
"R_cond_KW": 0.052365,
175-
"theta_jc_model": 0.052365,
227+
"Tj_C": 49.6,
228+
"Tj_K": 322.7,
229+
"R_cond_KW": 0.013514,
230+
"R_conv_KW": 0.1,
231+
"theta_jc_model": 0.013514,
176232
"power_density_Wm2": 2000000.0,
177-
"valid": true
233+
"valid": true,
234+
"in_envelope": true
178235
},
179236
{
180237
"chip": "SiC vs Si comparison (synthetic)",
181238
"segment": "material",
182-
"Tj_C": 3034.7,
183-
"R_cond_KW": 0.052365,
184-
"theta_jc_model": 0.052365,
239+
"Tj_C": 178.9,
240+
"Tj_K": 452.0,
241+
"R_cond_KW": 0.013514,
242+
"R_conv_KW": 1.0,
243+
"theta_jc_model": 0.013514,
185244
"power_density_Wm2": 1500000.0,
186-
"valid": true
245+
"valid": true,
246+
"in_envelope": true
187247
}
188248
],
189249
"material_checks": {
@@ -193,6 +253,7 @@
193253
},
194254
"gates": {
195255
"all_cases_valid": true,
256+
"all_in_envelope": true,
196257
"material_median_ok": true,
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"material_max_ok": true,
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"no_regressions": true

‎benchmarks/production_suite/cases.csv‎

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Original file line numberDiff line numberDiff line change
@@ -1,21 +1,21 @@
1-
chip,die_area_mm2,tdp_w,node_nm,theta_jc_kw,tj_max_c,cooling,segment,source
2-
NVIDIA A100,826,400,7,0.029,83,liquid,accelerator,"NVIDIA A100 Datasheet 2020"
3-
NVIDIA H100,814,700,4,,83,liquid,accelerator,"NVIDIA H100 Datasheet 2022"
4-
AMD MI300X,750,750,5,,90,liquid,accelerator,"AMD MI300X Datasheet 2023"
5-
AMD EPYC 9654,72,360,5,,96,server_air,server,"AMD EPYC 9004 PPR 2022"
6-
Intel Xeon w9-3495X,400,350,7,,100,server_air,server,"Intel ARK 2023"
7-
Intel i9-13900K,257,253,10,0.43,100,desktop_air,desktop,"Intel ARK 2022"
8-
AMD Ryzen 9 7950X,71,170,5,0.11,95,desktop_air,desktop,"AMD Ryzen Datasheet 2022"
9-
Apple M1,120,20,5,,105,fanless,mobile,"Apple / Anandtech 2020"
10-
Apple M2 Pro,228,30,5,,105,fanless,mobile,"Apple / Anandtech 2023"
11-
Qualcomm Snapdragon 8 Gen 2,123,12,4,,105,fanless,mobile,"Qualcomm 2022"
12-
AMD Ryzen 7 5800X,81,105,7,,90,desktop_air,desktop,"AMD Datasheet 2020"
13-
Intel Xeon Platinum 8380,660,270,10,,100,server_air,server,"Intel ARK 2021"
14-
Apple M1 Ultra,420,60,5,,105,fan,mobile,"Apple 2022"
15-
NVIDIA RTX 4090,609,450,4,,83,desktop_air,accelerator,"NVIDIA Datasheet 2022"
16-
AMD EPYC 7763,81,280,7,,90,server_air,server,"AMD EPYC 7003 PPR 2021"
17-
Heterogeneous SoC (synthetic),100,50,5,,95,server_air,soc,"Aethermor synthetic"
18-
Adiabatic crossover (synthetic),100,25,5,,95,server_air,paradigm,"Aethermor synthetic"
19-
Cooling tradeoff (synthetic),100,100,5,,400,variable,cooling,"Aethermor synthetic"
20-
Diamond spreader (synthetic),100,200,5,,700,liquid,material,"Aethermor synthetic"
21-
SiC vs Si comparison (synthetic),100,150,5,,500,server_air,material,"Aethermor synthetic"
1+
chip,die_area_mm2,tdp_w,node_nm,theta_jc_kw,tj_max_c,cooling,segment,pkg_area_mm2,h_conv,source
2+
NVIDIA A100,826,400,7,0.029,83,liquid,accelerator,5000,5000,"NVIDIA A100 Datasheet 2020"
3+
NVIDIA H100,814,700,4,,83,liquid,accelerator,5000,5000,"NVIDIA H100 Datasheet 2022"
4+
AMD MI300X,750,750,5,,90,liquid,accelerator,5800,5000,"AMD MI300X Datasheet 2023"
5+
AMD EPYC 9654,72,30,5,,96,server_air,server,4350,500,"AMD EPYC 9004 PPR 2022 (single CCD: 360W/12)"
6+
Intel Xeon w9-3495X,400,350,7,,100,server_air,server,4500,500,"Intel ARK 2023"
7+
Intel i9-13900K,257,253,10,0.43,100,desktop_air,desktop,1026,3000,"Intel ARK 2022"
8+
AMD Ryzen 9 7950X,71,170,5,0.11,95,desktop_air,desktop,1200,2500,"AMD Ryzen Datasheet 2022"
9+
Apple M1,120,20,5,,105,fanless,mobile,2000,400,"Apple / Anandtech 2020"
10+
Apple M2 Pro,228,30,5,,105,fanless,mobile,2500,400,"Apple / Anandtech 2023"
11+
Qualcomm Snapdragon 8 Gen 2,123,12,4,,105,fanless,mobile,600,200,"Qualcomm 2022"
12+
AMD Ryzen 7 5800X,81,105,7,,90,desktop_air,desktop,1200,2500,"AMD Datasheet 2020"
13+
Intel Xeon Platinum 8380,660,270,10,,100,server_air,server,4500,500,"Intel ARK 2021"
14+
Apple M1 Ultra,420,60,5,,105,fan,mobile,3000,600,"Apple 2022"
15+
NVIDIA RTX 4090,609,450,4,,83,desktop_air,accelerator,3600,2000,"NVIDIA Datasheet 2022"
16+
AMD EPYC 7763,81,35,7,,90,server_air,server,4350,500,"AMD EPYC 7003 PPR 2021 (single CCD: 280W/8)"
17+
Heterogeneous SoC (synthetic),100,50,5,,95,server_air,soc,2000,500,"Aethermor synthetic"
18+
Adiabatic crossover (synthetic),100,25,5,,95,server_air,paradigm,2000,500,"Aethermor synthetic"
19+
Cooling tradeoff (synthetic),100,100,5,,400,liquid,cooling,2000,5000,"Aethermor synthetic"
20+
Diamond spreader (synthetic),100,200,5,,700,liquid,material,2000,5000,"Aethermor synthetic"
21+
SiC vs Si comparison (synthetic),100,150,5,,500,server_air,material,2000,500,"Aethermor synthetic"

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